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Product Overview
Product Features
TAMURA (Tamura) TLF-204-93IVT Solder Paste Features:
Uses lead-free (tin/silver/copper) solder alloy;
Viscosity changes little over time during continuous printing, ensuring stable printing results;
Effectively reduces voids;
Effectively reduces solder ball formation between components;
Effectively improves preheat flowability;
As a lead-free solder paste, it shows good reflow performance even under high-temperature reflow profiles;
Exhibits good wettability on fine pads with 0.5mm pitch, such as BGA.
Product Specifications
| Item | Characteristics (TLF-204-93IVT(SH)) | Test Method |
| Alloy Composition | Sn96.5/Ag3.0/Cu0.5 | JIS Z 3282(1999) |
| Melting Point (℃) | 216～220℃ | Measured by DSC |
| Solder Particle Size (μm) | 20~38 μm | Measured by Laser Light Refraction Method |
| Tin Powder Shape | Spherical | JIS Z 3284(1994) |
| Flux Content | 11.8% | JIS Z 3284(1994) |
| Chlorine Content | 0.0% | JIS Z 3197(1999) |
| Viscosity | 210Pa.s | JIS Z 3284(1994) |
| Aqueous Solution Resistance Test | 5×10⁴ Ω·cm or above | JIS Z 3197(1999) |
| Insulation Resistance Test | 1×10⁹ Ω or above | JIS Z 3284(1994) |
| Spreadability Test | 0.20mm or less | Print solder paste on a ceramic substrate, heat at 15 0℃ for 60 seconds, measure the spread width before and after solder heating. Measure the spread width to determine the spread amount. STD-092b Note |
| Solder Ball Test | Almost no solder balls occur | Print solder paste on a ceramic substrate, melt and heat, then observe with a 50x microscope. STD-009e Note |
| Solder Diffusion Test | 76% or more | JIS Z 3197(1986) |
| Copper Plate Corrosion Test | No corrosion observed | JIS Z 3197(1986) |
| Adhesion Test of Solder Paste Residue after Reflow | Pass | JIS Z 3284(1994) |
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OUTLETS
Service Outlets
Shanghai-Head Office
Shanghai Hapoin Enterprise Development Co., Ltd.
Address: Building 6, Southern Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
Telephone:+86 150 2686 5822
Email:info@hapoin.com
Shenzhen Branch
Shenzhen Hapoin Ruihe Technology Development Co., Ltd.
Address: Room 302, 3rd Floor, Building B, Kaicheng High-tech Park, Dalang Street, Longhua District, Shenzhen
Telephone:+86 0755 2223 2285
Email:sales@hapoin.com
Hong Kong Branch
HAPOIN ENTERPISE LIMITED
Address: Unit 917A, 9/F., Tower A, New Mandarin Plaza, No. 14 Science Museum Road
Telephone:+00852 61187991
Email:sales@hapoin.com
Vietnam Branch
HAPOIN VIETNAM
Address: 6th Floor, CTM Office Building, No. 139, Zhipiao Road, Zhipiao District, Hanoi, Vietnam
Telephone:+84 398 848 969
Email:sales@hapoin.com
Japan Branch
HAPOIN CO., LTD.
Address: 6th Floor, 2-3-8 Iwamotocho, Chiyoda-ku, Tokyo
Telephone:+81 070 9356 1267
Email:sales@hapoin.com
Kunshan Office
Kunshan Office
Address: 10th Floor, Building B, Modern Plaza, No. 8, Weiye Road, Yushan Town, Kunshan City
Telephone:+86 150 2686 5822
Email:sales@hapoin.com
Taipei Branch
Uniwin Chemical Co.,LTD.
Address: No. 14, Alley 3, Lane 250, Section 2, Huanhe South Road, Taipei 10853
Telephone:+886 02 2336 2202
Email:sales@hapoin.com
Beijing Office
Beijing Office
Address: Room 306, Building 4, Zhongtou Oriental, West Zhihe North, Chaoyang District, Beijing
Telephone:+86 150 2686 5822
Email:sales@hapoin.com
Contact Number
Headquarter Address
6, South Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
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