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MITODENKO Small Selective Soldering Machine "MID25-330T" Specifications
| Usable Substrate Size |
Substrate Size: 50W × 50L to 250W × 330L mm Substrate Thickness: 0.8 to 2 mm Pin Lead Length: Under 3 mm Component Height: Based on the bottom of the substrate Within 50 mm above the substrate Within 25 mm below the substrate Substrate Warpage: Within 0.5 mm Substrate Weight: Including attached components, within 15 Kg |
| Production Method | Solder pot fixed / Substrate XYZ positioning attached |
| Color |
Our standard color |
| Weight | 130 kg [Including 16 Kg solder (density 7.3)] Main body: 93 kg, Solder pot: 37 kg |
| Device Overall Dimensions | W620 mm (890 mm when solder pot pulled out) × L810 mm × H1220 mm |
| Nitrogen Purity | 99.99% |
MITODENKO Small Selective Soldering Machine "MID25-330T" Substrate Placement Section Specifications
| Drive Method | Stepper motor drive for X-axis and Y-axis Z-axis Drive Drive Power per Axis: Approx. 25W |
| Substrate Weight | Within 2.5 Kg |
| X-axis Movement Speed | During soldering: 0.1 mm to 100 mm/sec Solder Joint Movement Speed: 100 to 300 mm/sec |
| Y-axis Movement Speed | During soldering: 0.1 mm to 100 mm/sec Solder Joint Movement Speed: 100 to 300 mm/sec |
| Z-axis Movement Speed | During soldering: 0 to 50 mm/sec Solder Joint Movement Speed: 25 mm/sec |
| Substrate Placement Section | Minimum 3 mm from PCB process edge |
| Substrate Fixing Method | Manual movement fixing |
MITODENKO Small Selective Soldering Machine "MID25-330T" N2 Preheating Section Specifications
| Heating Method | Direct heating by heating tube |
| Power | Heating tube: Single-phase 200V 1.1KW |
| N2 Usage | 0.5 MPa, 15 ℓ/min to 25 ℓ/min |
| N2 Set Temperature Range | Up to 350℃ ※However, usage life decreases if exceeding 350℃. |
| Common N2 Temperature | 350℃ ±10% |
| N2 Flow Adjustment | Flow meter adjustment |
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