Product Video
Product Overview
Introduction to MALCOM SWB-2 Solderability Tester:
The MALCOM SWB-2 Solderability Tester (also known as Wetting Balance or Solder Wetting Balance) traditionally required the operator to apply flux and remove excess flux manually. In such cases, uneven flux application could adversely affect test results. Especially when there are issues in test data from other operators, it is very difficult to determine whether the problem is due to uneven flux application, the application process itself, or the sample itself, often necessitating retesting.
This device fully automates the flux application and removal steps, reducing flux unevenness caused by the operator and enabling high-performance testing with reproducible results.
The automatic mode can perform all steps including flux application, removal, testing, and result output automatically. Additionally, the manual mode allows individual operation of each step, enabling tests under conditions such as skipping the removal step.
Product Features
Features of MALCOM SWB-2 Solderability Tester (Solder Wettability Balance):
● Automated testing from flux spraying (with flux temperature control function) to test completion reduces instability caused by manual testing.
● Evaluation corresponding to solderability test methods can be performed based on the soldering balance method of JIS Z3198 (lead-free soldering test method).
● Easy replacement of solder and flux.
● By selecting dedicated software, test operations can be performed on a computer, allowing simple analysis, waveform display, and data saving.
● Uses an electronic balance sensor capable of detecting minute forces.
● Wetting angle can be calculated via software (requires customer to input surface tension data).
● Automatic flux application and removal process.
● Testing under nitrogen atmosphere is possible using an optional nitrogen cover.
● External camera device can be connected to record the test process. (option)
Product Specifications
| Model | MALCOM SWB-2 | |
| Load Sensor | Principle | Electronic Balance Sensor (EBS) |
| Measurement Range | 100mN to -50mN | |
| Measurement Accuracy | ±(0.1mN + 1 digit) | |
| Resolution | Less than 9mN: 0.01mN 9mN and above: 0.05mN | |
| Temperature Sensor | Measurement Range | 0 to 400℃ |
| Measurement Accuracy | ±2℃ | |
| Immersion Time | 1 to 200s | |
| Immersion Depth | 0.05 to 25.00mm Range 0.001mm | |
| Immersion Speed | 1 to 50mm/s | |
| Solder Temperature Setting | Room Temperature to 400℃ | |
| Applicable Standards (Domestic) | Automatic Testing (Flux Application, Removal, Testing) JIS Z3198-4 and C0053 JEITA ET7411 (Solder Bath) |
|
| Applicable Standards (International) | ISO 9455-16, IEC 60068-2-54 and 60068-2-69 (Solder Bath) ANSI J-STD-003, MIL-STD-883 (METHOD 2022.0) and IPC-TM-650 (2.4.14.2) |
|
| N2 Measurement | Oxygen Concentration: below 500ppm (option) | |
| Data Transmission Method | USB※ Dedicated Software (option) Windows 2000/XP | |
| Power Supply | AC100V | |
| Device Dimensions | 300mm (W) × 300mm (D) × 370mm (H) | |
| Weight | 16kg | |
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